The AVP, a size, weight, and power (SWaP) optimized advanced video processor, provides best-in-class artificial intelligence performance for thermal infrared and visible camera perception systems. It incorporates the latest Qualcomm® QCS8550, the industry’s most advanced mobile processor system on chip (SoC) featuring up to 48 TOPS inference compute performance. The QCS8550 is part of Qualcomm’s Product Longevity Program, ensuring future-proof product stability.
The AVP is designed to efficiently run Teledyne FLIR Prism AI software providing detection, classification, and target tracking and Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction. Prism software runs efficiently on the AVP leveraging the available system on module (SoM) functions to provide critical edge AI capabilities for automotive, airborne, unmanned, counter-UAS (CUAS), perimeter security, and intelligence, surveillance, and reconnaissance (ISR) applications.
- Productos
- Cámaras, componentes y láseres OEM
- Kits de desarrollo de software
- FLIR AVP
Añadido al carro
Modelo:
Su pedido cumple los requisitos para el envío gratuito de 2 días y devoluciones fáciles
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Industry-Leading Size, Weight, and Power (SWaP) Consumption
Run Prism AI and ISP on the highest-performance QCS8550 SoC in the industry
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FUTURE PROOF YOUR DESIGN
Flexible hardware is part of the Qualcomm Product Longevity Program
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BUILT FOR INTEGRATORS
Simplify development and reduce risk with Prism software and support
Especificaciones
General
- Memoria
- 16GB LPDDR5x
- Número de pieza
- SOM 4251537
Devkit Part Number: 421-0100-00
- Procesador
- Qualcomm QCS8550
64-bit Octa-Core
Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU
Qualcomm Adreno GPU 740
Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
Qualcomm Secure Processing Unit for advanced secure use cases
Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera.
Almacenamiento
- Almacenamiento
- 256GB UFS 3.1
Comunicación y almacenamiento de datos
- Vídeo
- UHD video processing unit
AV1 decode
Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
Native encode support for H.265 Main 10, H.265 Main, H.264 high formats
Mecánico
- Dimensiones
- SOM Board: 40.27 x 33.41 mm LGA form factor
- Peso
- 5 grams (without shield)
Other
- Operating Environment [OE]
- Input Voltage: 3.6V Operating Temperature: -20 to +60 °C
- Operating System [OS]
- OS - Linux LE (r76)
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Restricciones de exportación
Restricciones de exportación
La información contenida en esta página se refiere a productos que pueden estar sujetos a la Normativa internacional sobre tráfico de armas (International Traffic in Arms Regulations, ITAR) (título 22 de C.F.R., secciones 120-130) o a la Normativa de administración de exportaciones (Export Administration Regulations, EAR) (título 15 del C.F.R., secciones 730-774) dependiendo de las especificaciones del producto final; la jurisdicción y clasificación se proporcionarán previa solicitud.
